Products

Six-layer second-order UAV PCB board&pcba
  • Six-layer second-order UAV PCB board&pcba
  • Six-layer second-order UAV PCB board&pcba
  • Six-layer second-order UAV PCB board&pcba
  • Six-layer second-order UAV PCB board&pcba
  • Six-layer second-order UAV PCB board&pcba

Six-layer Second-order UAV PCB Board&pcba

Description:

Number of layers: 6 layers Material: FR4 Process: Gold sinking minimum drilling: 0.1mm minimum line width: 0.1mm minimum line distance: 0.1mm

Blind buried circuit boards, also known as HDI boards, are often used in high-end products such as mobile phones, GPS navigation, drone circuit boards, and so on.

Blind buried circuit boards, also known as HDI boards, are often used in high-end products such as mobile phones, GPS navigation, drone circuit boards, and so on. The structure of the conventional multi-layer circuit board consists of an inner line and an outer line, and the process of drilling and metallization in the hole is used to achieve the connection function between the internal layers of the line. With the development of electronic products to high density and high precision, the corresponding requirements for circuit boards are put forward.