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Six-layer first-order millimeter-wave radar PCB board&PCBA
  • Six-layer first-order millimeter-wave radar PCB board&PCBA
  • Six-layer first-order millimeter-wave radar PCB board&PCBA
  • Six-layer first-order millimeter-wave radar PCB board&PCBA
  • Six-layer first-order millimeter-wave radar PCB board&PCBA
  • Six-layer first-order millimeter-wave radar PCB board&PCBA

Six-layer First-order Millimeter-wave Radar PCB Board&PCBA

Description:

Blind hole circuit board is the abbreviation of High Density Interconnector (High Density Interconnector), is a kind of (technology) for the production of printed circuit boards, and a circuit board with relatively high line distribution density using micro-blind hole technology. HDI is a compact product designed for small volume users.

 

Blind vias: A blind hole is a type of hole that connects the inner PCB line with the surface PCB line, and this hole does not penetrate the entire board. (Generally used in 4 layers and above)

 

Buried vias: The buried hole is only the type of hole connecting the line between the inner layers, which is not visible from the PCB surface. (Generally used in 6 layers and above)

 

Benefits: can increase the cable space;

 

Disadvantages: The process cost is very high, the general electronic products are not used, and only in particularly high-end products will be applied.